(kicad_pcb (version 20171130) (host pcbnew "(5.1.2-1)-1")
  (general
    (thickness 1.6)
    (drawings 10)
    (tracks 275)
    (zones 0)
    (modules 42)
    (nets 55)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.3)
    (user_trace_width 0.3)
    (user_trace_width 0.5)
    (user_trace_width 0.8)
    (user_trace_width 1.2)
    (user_trace_width 1.5)
    (trace_clearance 0.15)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.2)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.15)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 2.1 2.1)
    (pad_drill 1.1)
    (pad_to_mask_clearance 0.051)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (visible_elements FFFFFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer false)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin true)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue false)
      (plotinvisibletext false)
      (padsonsilk true)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "plot"))
  )
  (net 0 "")
  (net 1 "Net-(C1-Pad1)")
  (net 2 "Net-(C3-Pad1)")
  (net 3 "Net-(R5-Pad2)")
  (net 4 "Net-(R6-Pad2)")
  (net 5 Earth)
  (net 6 +5V)
  (net 7 "Net-(U1-Pad14)")
  (net 8 "Net-(U1-Pad13)")
  (net 9 "Net-(J3-Pad1)")
  (net 10 "Net-(J3-Pad2)")
  (net 11 "Net-(J3-Pad3)")
  (net 12 "Net-(J3-Pad4)")
  (net 13 "Net-(U1-Pad4)")
  (net 14 "Net-(U1-Pad5)")
  (net 15 "Net-(U1-Pad17)")
  (net 16 "Net-(U1-Pad18)")
  (net 17 "Net-(U1-Pad19)")
  (net 18 "Net-(U1-Pad20)")
  (net 19 "Net-(U1-Pad21)")
  (net 20 "Net-(U1-Pad22)")
  (net 21 "Net-(R8-Pad2)")
  (net 22 ADC)
  (net 23 "Net-(U3-Pad1)")
  (net 24 "Net-(U3-Pad2)")
  (net 25 "Net-(U3-Pad3)")
  (net 26 "Net-(U3-Pad14)")
  (net 27 "Net-(U3-Pad15)")
  (net 28 "Net-(U3-Pad16)")
  (net 29 VCC)
  (net 30 "Net-(R2-Pad1)")
  (net 31 "Net-(D1-Pad2)")
  (net 32 TXD)
  (net 33 RXD)
  (net 34 "Net-(U4-Pad9)")
  (net 35 "Net-(U4-Pad10)")
  (net 36 "Net-(U4-Pad11)")
  (net 37 "Net-(U4-Pad12)")
  (net 38 "Net-(U4-Pad15)")
  (net 39 "Net-(Q2-Pad2)")
  (net 40 "Net-(Q1-Pad1)")
  (net 41 "Net-(Q2-Pad1)")
  (net 42 "Net-(Q1-Pad2)")
  (net 43 RST)
  (net 44 GPIO0)
  (net 45 "Net-(C7-Pad1)")
  (net 46 "Net-(C9-Pad1)")
  (net 47 "Net-(J2-Pad4)")
  (net 48 "Net-(R13-Pad2)")
  (net 49 "Net-(R12-Pad2)")
  (net 50 "Net-(Y1-Pad2)")
  (net 51 "Net-(Y1-Pad4)")
  (net 52 "Net-(R10-Pad2)")
  (net 53 /D-)
  (net 54 /D+)
  (net_class Default "This is the default net class."
    (clearance 0.15)
    (trace_width 0.3)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net /D+)
    (add_net /D-)
    (add_net ADC)
    (add_net Earth)
    (add_net GPIO0)
    (add_net "Net-(C1-Pad1)")
    (add_net "Net-(C3-Pad1)")
    (add_net "Net-(C7-Pad1)")
    (add_net "Net-(C9-Pad1)")
    (add_net "Net-(D1-Pad2)")
    (add_net "Net-(J2-Pad4)")
    (add_net "Net-(J3-Pad1)")
    (add_net "Net-(J3-Pad2)")
    (add_net "Net-(J3-Pad3)")
    (add_net "Net-(J3-Pad4)")
    (add_net "Net-(Q1-Pad1)")
    (add_net "Net-(Q1-Pad2)")
    (add_net "Net-(Q2-Pad1)")
    (add_net "Net-(Q2-Pad2)")
    (add_net "Net-(R10-Pad2)")
    (add_net "Net-(R12-Pad2)")
    (add_net "Net-(R13-Pad2)")
    (add_net "Net-(R2-Pad1)")
    (add_net "Net-(R5-Pad2)")
    (add_net "Net-(R6-Pad2)")
    (add_net "Net-(R8-Pad2)")
    (add_net "Net-(U1-Pad13)")
    (add_net "Net-(U1-Pad14)")
    (add_net "Net-(U1-Pad17)")
    (add_net "Net-(U1-Pad18)")
    (add_net "Net-(U1-Pad19)")
    (add_net "Net-(U1-Pad20)")
    (add_net "Net-(U1-Pad21)")
    (add_net "Net-(U1-Pad22)")
    (add_net "Net-(U1-Pad4)")
    (add_net "Net-(U1-Pad5)")
    (add_net "Net-(U3-Pad1)")
    (add_net "Net-(U3-Pad14)")
    (add_net "Net-(U3-Pad15)")
    (add_net "Net-(U3-Pad16)")
    (add_net "Net-(U3-Pad2)")
    (add_net "Net-(U3-Pad3)")
    (add_net "Net-(U4-Pad10)")
    (add_net "Net-(U4-Pad11)")
    (add_net "Net-(U4-Pad12)")
    (add_net "Net-(U4-Pad15)")
    (add_net "Net-(U4-Pad9)")
    (add_net "Net-(Y1-Pad2)")
    (add_net "Net-(Y1-Pad4)")
    (add_net RST)
    (add_net RXD)
    (add_net TXD)
  )
  (net_class 3V3 ""
    (clearance 0.3)
    (trace_width 0.8)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net VCC)
  )
  (net_class 5V0 ""
    (clearance 0.4)
    (trace_width 1)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +5V)
  )
  (net_class "Resistor Array" ""
    (clearance 0.3)
    (trace_width 0.6)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
  )
  (module ESP8266:ESP-12E_SMD (layer B.Cu) (tedit 5D265FE1)
    (at 115.062 72.3865 180)
    (descr "Module, ESP-8266, ESP-12, 16 pad, SMD")
    (tags "Module ESP-8266 ESP8266")
    (fp_text reference U1 (at 6.858 -16.7675) (layer B.SilkS))
    (fp_text value ESP-12F (at 5.08 -6.35 90) (layer B.Fab) hide)
    (fp_text user "No Copper" (at 6.892 5.4 180) (layer B.CrtYd))
    (pad 22 smd rect (at 11.99 -15 90) (size 2.5 1.1) (drill (offset -0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 20 "Net-(U1-Pad22)"))
    (pad 21 smd rect (at 9.99 -15 90) (size 2.5 1.1) (drill (offset -0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 19 "Net-(U1-Pad21)"))
    (pad 20 smd rect (at 7.99 -15 90) (size 2.5 1.1) (drill (offset -0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 18 "Net-(U1-Pad20)"))
    (pad 19 smd rect (at 5.99 -15 90) (size 2.5 1.1) (drill (offset -0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 17 "Net-(U1-Pad19)"))
    (pad 18 smd rect (at 3.99 -15 90) (size 2.5 1.1) (drill (offset -0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(U1-Pad18)"))
    (pad 17 smd rect (at 1.99 -15 90) (size 2.5 1.1) (drill (offset -0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 15 "Net-(U1-Pad17)"))
    (pad 16 smd rect (at 14 0 180) (size 2.5 1.1) (drill (offset 0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 32 TXD))
    (pad 15 smd rect (at 14 -2 180) (size 2.5 1.1) (drill (offset 0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 33 RXD))
    (pad 14 smd rect (at 14 -4 180) (size 2.5 1.1) (drill (offset 0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 7 "Net-(U1-Pad14)"))
    (pad 13 smd rect (at 14 -6 180) (size 2.5 1.1) (drill (offset 0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(U1-Pad13)"))
    (pad 12 smd rect (at 14 -8 180) (size 2.5 1.1) (drill (offset 0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 44 GPIO0))
    (pad 11 smd rect (at 14 -10 180) (size 2.5 1.1) (drill (offset 0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(R6-Pad2)"))
    (pad 10 smd rect (at 14 -12 180) (size 2.5 1.1) (drill (offset 0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(R5-Pad2)"))
    (pad 9 smd rect (at 14 -14 180) (size 2.5 1.1) (drill (offset 0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 5 Earth))
    (pad 8 smd rect (at 0 -14 180) (size 2.5 1.1) (drill (offset -0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 29 VCC))
    (pad 7 smd rect (at 0 -12 180) (size 2.5 1.1) (drill (offset -0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 2 "Net-(C3-Pad1)"))
    (pad 6 smd rect (at 0 -10 180) (size 2.5 1.1) (drill (offset -0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (pad 5 smd rect (at 0 -8 180) (size 2.5 1.1) (drill (offset -0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 14 "Net-(U1-Pad5)"))
    (pad 4 smd rect (at 0 -6 180) (size 2.5 1.1) (drill (offset -0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 13 "Net-(U1-Pad4)"))
    (pad 3 smd rect (at 0 -4 180) (size 2.5 1.1) (drill (offset -0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 30 "Net-(R2-Pad1)"))
    (pad 2 smd rect (at 0 -2 180) (size 2.5 1.1) (drill (offset -0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 22 ADC))
    (pad 1 smd rect (at 0 0 180) (size 2.5 1.1) (drill (offset -0.7 0)) (layers B.Cu B.Paste B.Mask)
      (net 43 RST))
    (model ${ESPLIB}/ESP8266.3dshapes/ESP-12.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 121.575 75.4115 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R15 (at 3.3285 -0.091 270) (layer B.SilkS))
    (fp_text value 1K (at 0 -1.65 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 22 ADC))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 52 "Net-(R10-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TerminalBlock_TE-Connectivity:TerminalBlock_TE_282834-2_1x02_P2.54mm_Horizontal (layer F.Cu) (tedit 5B1EC513)
    (at 129.286 87.376 270)
    (descr "Terminal Block TE 282834-2, 2 pins, pitch 2.54mm, size 5.54x6.5mm^2, drill diamater 1.1mm, pad diameter 2.1mm, see http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F282834%7FC1%7Fpdf%7FEnglish%7FENG_CD_282834_C1.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_TE-Connectivity")
    (tags "THT Terminal Block TE 282834-2 pitch 2.54mm size 5.54x6.5mm^2 drill 1.1mm pad 2.1mm")
    (fp_text reference J7 (at 1.27 -4.37 270) (layer F.SilkS) hide)
    (fp_text value Reed_1 (at 1.27 4.37 270) (layer F.Fab))
    (fp_text user %R (at 1.27 2 270) (layer F.Fab))
    (pad 2 thru_hole circle (at 2.54 0 270) (size 2.1 2.1) (drill 1.1) (layers *.Cu *.Mask)
      (net 5 Earth))
    (pad 1 thru_hole rect (at 0 0 270) (size 2.1 2.1) (drill 1.1) (layers *.Cu *.Mask)
      (net 2 "Net-(C3-Pad1)"))
    (model ${KISYS3DMOD}/TerminalBlock_TE-Connectivity.3dshapes/TerminalBlock_TE_282834-2_1x02_P2.54mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TerminalBlock_TE-Connectivity:TerminalBlock_TE_282834-2_1x02_P2.54mm_Horizontal (layer F.Cu) (tedit 5B1EC513)
    (at 129.286 80.772 270)
    (descr "Terminal Block TE 282834-2, 2 pins, pitch 2.54mm, size 5.54x6.5mm^2, drill diamater 1.1mm, pad diameter 2.1mm, see http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F282834%7FC1%7Fpdf%7FEnglish%7FENG_CD_282834_C1.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_TE-Connectivity")
    (tags "THT Terminal Block TE 282834-2 pitch 2.54mm size 5.54x6.5mm^2 drill 1.1mm pad 2.1mm")
    (fp_text reference J6 (at 1.27 -4.37 270) (layer F.SilkS) hide)
    (fp_text value Reed_1 (at 1.27 4.37 270) (layer F.Fab))
    (fp_text user %R (at 1.27 2 270) (layer F.Fab))
    (pad 2 thru_hole circle (at 2.54 0 270) (size 2.1 2.1) (drill 1.1) (layers *.Cu *.Mask)
      (net 5 Earth))
    (pad 1 thru_hole rect (at 0 0 270) (size 2.1 2.1) (drill 1.1) (layers *.Cu *.Mask)
      (net 1 "Net-(C1-Pad1)"))
    (model ${KISYS3DMOD}/TerminalBlock_TE-Connectivity.3dshapes/TerminalBlock_TE_282834-2_1x02_P2.54mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:SW_SPST_TL3342 (layer F.Cu) (tedit 5A02FC95)
    (at 120.6754 87.8332 90)
    (descr "Low-profile SMD Tactile Switch, https://www.e-switch.com/system/asset/product_line/data_sheet/165/TL3342.pdf")
    (tags "SPST Tactile Switch")
    (attr smd)
    (fp_text reference FLASH (at 5.0673 0.0762 180) (layer F.SilkS))
    (fp_text value FLASH (at 0 2.5 90) (layer F.Fab))
    (fp_text user %R (at 0 -2.5 90) (layer F.Fab))
    (pad 2 smd rect (at 3.15 1.9 90) (size 1.7 1) (layers F.Cu F.Paste F.Mask)
      (net 5 Earth))
    (pad 2 smd rect (at -3.15 1.9 90) (size 1.7 1) (layers F.Cu F.Paste F.Mask)
      (net 5 Earth))
    (pad 1 smd rect (at 3.15 -1.9 90) (size 1.7 1) (layers F.Cu F.Paste F.Mask)
      (net 44 GPIO0))
    (pad 1 smd rect (at -3.15 -1.9 90) (size 1.7 1) (layers F.Cu F.Paste F.Mask)
      (net 44 GPIO0))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_SPST_TL3342.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:SW_SPST_TL3342 (layer F.Cu) (tedit 5A02FC95)
    (at 120.7262 77.6478 270)
    (descr "Low-profile SMD Tactile Switch, https://www.e-switch.com/system/asset/product_line/data_sheet/165/TL3342.pdf")
    (tags "SPST Tactile Switch")
    (attr smd)
    (fp_text reference RESET (at -5.0546 0.0254) (layer F.SilkS))
    (fp_text value RESET (at 0 2.5 270) (layer F.Fab))
    (fp_text user %R (at 0 -2.5 270) (layer F.Fab))
    (pad 2 smd rect (at 3.15 1.9 270) (size 1.7 1) (layers F.Cu F.Paste F.Mask)
      (net 43 RST))
    (pad 2 smd rect (at -3.15 1.9 270) (size 1.7 1) (layers F.Cu F.Paste F.Mask)
      (net 43 RST))
    (pad 1 smd rect (at 3.15 -1.9 270) (size 1.7 1) (layers F.Cu F.Paste F.Mask)
      (net 5 Earth))
    (pad 1 smd rect (at -3.15 -1.9 270) (size 1.7 1) (layers F.Cu F.Paste F.Mask)
      (net 5 Earth))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_SPST_TL3342.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Crystal:Crystal_SMD_SeikoEpson_FA238V-4Pin_3.2x2.5mm_HandSoldering (layer F.Cu) (tedit 5A0FD1B2)
    (at 107.8738 88.4682 180)
    (descr "crystal Epson Toyocom FA-238 series http://www.mouser.com/ds/2/137/1721499-465440.pdf, hand-soldering, 3.2x2.5mm^2 package")
    (tags "SMD SMT crystal hand-soldering")
    (attr smd)
    (fp_text reference Y1 (at 0 -3.4798 180) (layer F.SilkS))
    (fp_text value HC-49 (at 0 3.55 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 4 smd rect (at -1.55 -1.25 180) (size 2.1 1.8) (layers F.Cu F.Paste F.Mask)
      (net 51 "Net-(Y1-Pad4)"))
    (pad 3 smd rect (at 1.55 -1.25 180) (size 2.1 1.8) (layers F.Cu F.Paste F.Mask)
      (net 46 "Net-(C9-Pad1)"))
    (pad 2 smd rect (at 1.55 1.25 180) (size 2.1 1.8) (layers F.Cu F.Paste F.Mask)
      (net 50 "Net-(Y1-Pad2)"))
    (pad 1 smd rect (at -1.55 1.25 180) (size 2.1 1.8) (layers F.Cu F.Paste F.Mask)
      (net 45 "Net-(C7-Pad1)"))
    (model ${KISYS3DMOD}/Crystal.3dshapes/Crystal_SMD_SeikoEpson_FA238V-4Pin_3.2x2.5mm_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 97 71.3615 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R14 (at 0.126 -1.6256 90) (layer B.SilkS))
    (fp_text value 10K (at 0 -1.65 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 29 VCC))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 32 TXD))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SMA (layer F.Cu) (tedit 586432E5)
    (at 89.6305 78.994 180)
    (descr "Diode SMA (DO-214AC)")
    (tags "Diode SMA (DO-214AC)")
    (attr smd)
    (fp_text reference D1 (at -0.5395 2.54 180) (layer F.SilkS))
    (fp_text value M7 (at 0 2.6 180) (layer F.Fab))
    (fp_text user %R (at 0 -2.5 180) (layer F.Fab))
    (pad 1 smd rect (at -2 0 180) (size 2.5 1.8) (layers F.Cu F.Paste F.Mask)
      (net 6 +5V))
    (pad 2 smd rect (at 2 0 180) (size 2.5 1.8) (layers F.Cu F.Paste F.Mask)
      (net 31 "Net-(D1-Pad2)"))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMA.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 105.1433 73.406)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R12 (at -3.4925 -0.127) (layer F.SilkS))
    (fp_text value 470 (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 49 "Net-(R12-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 33 RXD))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 114.7445 78.867 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R11 (at -2.5654 0.4064 270) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 41 "Net-(Q2-Pad1)"))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 42 "Net-(Q1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 105.1433 71.4375)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R13 (at -3.556 0.127) (layer F.SilkS))
    (fp_text value 470 (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 32 TXD))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 48 "Net-(R13-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 103.4796 88.4682 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C9 (at 3.4798 -0.1524 180) (layer F.SilkS))
    (fp_text value 22pF (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 5 Earth))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 46 "Net-(C9-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 101.7905 79.121 180)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C10 (at -0.0635 -1.905 180) (layer F.SilkS))
    (fp_text value 10uF (at 0 1.82 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 29 VCC))
    (pad 2 smd roundrect (at 1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 5 Earth))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_USB:USB_Micro-B_Molex_47346-0001 (layer F.Cu) (tedit 5C241D57)
    (at 81.7245 88.7095 270)
    (descr "Micro USB B receptable with flange, bottom-mount, SMD, right-angle (http://www.molex.com/pdm_docs/sd/473460001_sd.pdf)")
    (tags "Micro B USB SMD")
    (attr smd)
    (fp_text reference J2 (at 0.0635 -3.6195 270) (layer F.SilkS))
    (fp_text value USB_B_Micro (at 0 4.6 90) (layer F.Fab))
    (fp_text user "PCB Edge" (at 0 2.67 90) (layer Dwgs.User))
    (fp_text user %R (at 0 1.2 270) (layer F.Fab))
    (pad 1 smd rect (at -1.3 -1.46 270) (size 0.45 1.38) (layers F.Cu F.Paste F.Mask)
      (net 31 "Net-(D1-Pad2)"))
    (pad 2 smd rect (at -0.65 -1.46 270) (size 0.45 1.38) (layers F.Cu F.Paste F.Mask)
      (net 53 /D-))
    (pad 3 smd rect (at 0 -1.46 270) (size 0.45 1.38) (layers F.Cu F.Paste F.Mask)
      (net 54 /D+))
    (pad 4 smd rect (at 0.65 -1.46 270) (size 0.45 1.38) (layers F.Cu F.Paste F.Mask)
      (net 47 "Net-(J2-Pad4)"))
    (pad 5 smd rect (at 1.3 -1.46 270) (size 0.45 1.38) (layers F.Cu F.Paste F.Mask)
      (net 5 Earth))
    (pad 6 smd rect (at -2.4625 -1.1 270) (size 1.475 2.1) (layers F.Cu F.Paste F.Mask)
      (net 5 Earth))
    (pad 6 smd rect (at 2.4625 -1.1 270) (size 1.475 2.1) (layers F.Cu F.Paste F.Mask)
      (net 5 Earth))
    (pad 6 smd rect (at -2.91 1.2 270) (size 2.375 1.9) (layers F.Cu F.Paste F.Mask)
      (net 5 Earth))
    (pad 6 smd rect (at 2.91 1.2 270) (size 2.375 1.9) (layers F.Cu F.Paste F.Mask)
      (net 5 Earth))
    (pad 6 smd rect (at -0.84 1.2 270) (size 1.175 1.9) (layers F.Cu F.Paste F.Mask)
      (net 5 Earth))
    (pad 6 smd rect (at 0.84 1.2 270) (size 1.175 1.9) (layers F.Cu F.Paste F.Mask)
      (net 5 Earth))
    (model ${KISYS3DMOD}/Connector_USB.3dshapes/USB_Micro-B_Molex_47346-0001.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:SOIC-16_3.9x9.9mm_P1.27mm (layer F.Cu) (tedit 5A02F2D3)
    (at 108.062 79.756)
    (descr "16-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U4 (at -0.112 -0.0889) (layer F.SilkS))
    (fp_text value CH340G (at 0 6) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -2.7 -4.445) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 5 Earth))
    (pad 2 smd rect (at -2.7 -3.175) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 49 "Net-(R12-Pad2)"))
    (pad 3 smd rect (at -2.7 -1.905) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 48 "Net-(R13-Pad2)"))
    (pad 4 smd rect (at -2.7 -0.635) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 29 VCC))
    (pad 5 smd rect (at -2.7 0.635) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 54 /D+))
    (pad 6 smd rect (at -2.7 1.905) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 53 /D-))
    (pad 7 smd rect (at -2.7 3.175) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 45 "Net-(C7-Pad1)"))
    (pad 8 smd rect (at -2.7 4.445) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 46 "Net-(C9-Pad1)"))
    (pad 9 smd rect (at 2.7 4.445) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 34 "Net-(U4-Pad9)"))
    (pad 10 smd rect (at 2.7 3.175) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 35 "Net-(U4-Pad10)"))
    (pad 11 smd rect (at 2.7 1.905) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 36 "Net-(U4-Pad11)"))
    (pad 12 smd rect (at 2.7 0.635) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 37 "Net-(U4-Pad12)"))
    (pad 13 smd rect (at 2.7 -0.635) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 39 "Net-(Q2-Pad2)"))
    (pad 14 smd rect (at 2.7 -1.905) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 42 "Net-(Q1-Pad2)"))
    (pad 15 smd rect (at 2.7 -3.175) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 38 "Net-(U4-Pad15)"))
    (pad 16 smd rect (at 2.7 -4.445) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 29 VCC))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-16_3.9x9.9mm_P1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23 (layer F.Cu) (tedit 5A02FF57)
    (at 114.7445 83.566 270)
    (descr "SOT-23, Standard")
    (tags SOT-23)
    (attr smd)
    (fp_text reference Q2 (at 2.54 -0.0635) (layer F.SilkS))
    (fp_text value S8050 (at 0 2.5 270) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 3 smd rect (at 1 0 270) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 44 GPIO0))
    (pad 2 smd rect (at -1 0.95 270) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 39 "Net-(Q2-Pad2)"))
    (pad 1 smd rect (at -1 -0.95 270) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 41 "Net-(Q2-Pad1)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23 (layer F.Cu) (tedit 5A02FF57)
    (at 114.7445 76.073 90)
    (descr "SOT-23, Standard")
    (tags SOT-23)
    (attr smd)
    (fp_text reference Q1 (at 1.7018 1.4732 180) (layer F.SilkS))
    (fp_text value S8050 (at 0 2.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd rect (at -1 -0.95 90) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 40 "Net-(Q1-Pad1)"))
    (pad 2 smd rect (at -1 0.95 90) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 42 "Net-(Q1-Pad2)"))
    (pad 3 smd rect (at 1 0 90) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 43 RST))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 114.7445 80.772 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R9 (at -2.5781 -0.3302 270) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 39 "Net-(Q2-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 40 "Net-(Q1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 112.2934 88.4682 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C7 (at 3.4798 0.2794) (layer F.SilkS))
    (fp_text value 22pF (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 5 Earth))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 45 "Net-(C7-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 112.268 73.2028)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C8 (at 0 -1.82) (layer F.SilkS))
    (fp_text value 10uF (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 29 VCC))
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 5 Earth))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 118.745 75.874 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at -3.738 0.635 90) (layer B.SilkS))
    (fp_text value 10nF (at 0 -1.82 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 22 ADC))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 5 Earth))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 115.762 90.9574 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C5 (at 0 -1.9035 270) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.82 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 29 VCC))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 5 Earth))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 96.774 81.4324)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R7 (at 0.254 -3.4544) (layer B.SilkS))
    (fp_text value 10K (at 0 -1.65) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 29 VCC))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 44 GPIO0))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 96.774 83.4314)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R6 (at 0.254 -3.9294) (layer B.SilkS))
    (fp_text value 10K (at 0 -1.65) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 4 "Net-(R6-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 29 VCC))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 97.79 86.36 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at -3.048 0 90) (layer B.SilkS))
    (fp_text value 10K (at 0 -1.65 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 5 Earth))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 3 "Net-(R5-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 125.349 89.916 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at -3.048 0 270) (layer B.SilkS))
    (fp_text value 10K (at 0 -1.65 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 29 VCC))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 2 "Net-(C3-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 125.73 77.563666 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at -2.964333 0 90) (layer B.SilkS))
    (fp_text value 10K (at 0 -1.65 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 1 "Net-(C1-Pad1)"))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 29 VCC))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 123.698 77.563666 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at -2.964333 0 90) (layer B.SilkS))
    (fp_text value 10K (at 0 -1.65 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 29 VCC))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 30 "Net-(R2-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 119.634 71.3615 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at 2.972 0 90) (layer B.SilkS))
    (fp_text value 10K (at 0 -1.65 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 43 RST))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 29 VCC))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 121.5795 71.375 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R10 (at -3.5115 -0.0635 270) (layer B.SilkS))
    (fp_text value 2K2 (at 0 -1.65 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 5 Earth))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 52 "Net-(R10-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 123.525 73.3615 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R8 (at 3.2575 0.0635 90) (layer B.SilkS))
    (fp_text value 10K (at 0 -1.65 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 52 "Net-(R10-Pad2)"))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 21 "Net-(R8-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TerminalBlock_TE-Connectivity:TerminalBlock_TE_282834-2_1x02_P2.54mm_Horizontal (layer F.Cu) (tedit 5C26BA1F)
    (at 129.286 69.8246 90)
    (descr "Terminal Block TE 282834-2, 2 pins, pitch 2.54mm, size 5.54x6.5mm^2, drill diamater 1.1mm, pad diameter 2.1mm, see http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F282834%7FC1%7Fpdf%7FEnglish%7FENG_CD_282834_C1.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_TE-Connectivity")
    (tags "THT Terminal Block TE 282834-2 pitch 2.54mm size 5.54x6.5mm^2 drill 1.1mm pad 2.1mm")
    (fp_text reference SW4 (at 1.3335 4.3815 90) (layer F.SilkS) hide)
    (fp_text value DOWN (at 1.27 4.37 90) (layer F.Fab))
    (fp_text user %R (at 1.27 2 90) (layer F.Fab))
    (pad 2 thru_hole circle (at 2.54 0 90) (size 2.1 2.1) (drill 1.1) (layers *.Cu *.Mask)
      (net 21 "Net-(R8-Pad2)"))
    (pad 1 thru_hole rect (at 0 0 90) (size 2.1 2.1) (drill 1.1) (layers *.Cu *.Mask)
      (net 29 VCC))
    (model ${KISYS3DMOD}/TerminalBlock_TE-Connectivity.3dshapes/TerminalBlock_TE_282834-2_1x02_P2.54mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TerminalBlock_TE-Connectivity:TerminalBlock_TE_282834-2_1x02_P2.54mm_Horizontal (layer F.Cu) (tedit 5C26A012)
    (at 129.286 76.538666 90)
    (descr "Terminal Block TE 282834-2, 2 pins, pitch 2.54mm, size 5.54x6.5mm^2, drill diamater 1.1mm, pad diameter 2.1mm, see http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F282834%7FC1%7Fpdf%7FEnglish%7FENG_CD_282834_C1.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_TE-Connectivity")
    (tags "THT Terminal Block TE 282834-2 pitch 2.54mm size 5.54x6.5mm^2 drill 1.1mm pad 2.1mm")
    (fp_text reference SW3 (at 1.281167 4.318 90) (layer F.SilkS) hide)
    (fp_text value UP (at 1.27 4.37 90) (layer F.Fab))
    (fp_text user %R (at 1.27 2 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 2.1 2.1) (drill 1.1) (layers *.Cu *.Mask)
      (net 29 VCC))
    (pad 2 thru_hole circle (at 2.54 0 90) (size 2.1 2.1) (drill 1.1) (layers *.Cu *.Mask)
      (net 52 "Net-(R10-Pad2)"))
    (model ${KISYS3DMOD}/TerminalBlock_TE-Connectivity.3dshapes/TerminalBlock_TE_282834-2_1x02_P2.54mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_JST:JST_XH_B05B-XH-A_1x05_P2.50mm_Vertical (layer F.Cu) (tedit 5C26ABFF)
    (at 83.1215 70.6755 270)
    (descr "JST XH series connector, B05B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST XH side entry")
    (fp_text reference J3 (at -4.1275 0.3175) (layer F.SilkS))
    (fp_text value Motor (at 5 4.6 270) (layer F.Fab))
    (fp_text user %R (at 5 2.7 270) (layer F.Fab))
    (pad 5 thru_hole oval (at 10 0 270) (size 1.7 1.95) (drill 0.95) (layers *.Cu *.Mask)
      (net 6 +5V))
    (pad 4 thru_hole oval (at 7.5 0 270) (size 1.7 1.95) (drill 0.95) (layers *.Cu *.Mask)
      (net 12 "Net-(J3-Pad4)"))
    (pad 3 thru_hole oval (at 5 0 270) (size 1.7 1.95) (drill 0.95) (layers *.Cu *.Mask)
      (net 11 "Net-(J3-Pad3)"))
    (pad 2 thru_hole oval (at 2.5 0 270) (size 1.7 1.95) (drill 0.95) (layers *.Cu *.Mask)
      (net 10 "Net-(J3-Pad2)"))
    (pad 1 thru_hole roundrect (at 0 0 270) (size 1.7 1.95) (drill 0.95) (layers *.Cu *.Mask) (roundrect_rratio 0.147)
      (net 9 "Net-(J3-Pad1)"))
    (model ${KISYS3DMOD}/Connector_JST.3dshapes/JST_XH_B05B-XH-A_1x05_P2.50mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 118.745 85.874 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at -0.022 -1.905 270) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.82 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 2 "Net-(C3-Pad1)"))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 5 Earth))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 98.806 75.7555)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at -1.524 2.2225 180) (layer F.SilkS))
    (fp_text value 10uF (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0 -270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 5 Earth))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 6 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 118.745 80.899 90)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 0 1.905 90) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.82 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 1 "Net-(C1-Pad1)"))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 5 Earth))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_2816_7142Metric_Pad3.20x4.45mm_HandSolder (layer F.Cu) (tedit 5B341556)
    (at 88.7095 68.8975 90)
    (descr "Capacitor SMD 2816 (7142 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: https://www.vishay.com/docs/30100/wsl.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at -5.2705 0.1905) (layer F.SilkS))
    (fp_text value 100uF (at 0 3.18 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -2.6 0 90) (size 3.2 4.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.078125)
      (net 29 VCC))
    (pad 2 smd roundrect (at 2.6 0 90) (size 3.2 4.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.078125)
      (net 5 Earth))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_2816_7142Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_BarrelJack:BarrelJack_Horizontal_DS_201 (layer F.Cu) (tedit 5C269E9F)
    (at 91.6305 83.312 90)
    (descr "DC Barrel Jack")
    (tags "Power Jack")
    (fp_text reference J1 (at 2.032 3.1115 180) (layer F.SilkS))
    (fp_text value Barrel_Jack (at -6.2 -5.5 90) (layer F.Fab))
    (fp_text user %R (at -3 -2.95 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 3.5 3.5) (drill oval 1 3) (layers *.Cu *.Mask)
      (net 6 +5V))
    (pad 2 thru_hole roundrect (at -6 0 90) (size 3 3.5) (drill oval 1 3) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 5 Earth))
    (model ${KISYS3DMOD}/Connector_BarrelJack.3dshapes/BarrelJack_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:SOIC-16W_5.3x10.2mm_P1.27mm (layer B.Cu) (tedit 5A02F2D3)
    (at 90.424 75.0215 180)
    (descr "16-Lead Plastic Small Outline (SO) - Wide, 5.3 mm Body (http://www.ti.com/lit/ml/msop002a/msop002a.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U3 (at 0 6.477 180) (layer B.SilkS))
    (fp_text value ULN2003A (at 0 -6.2 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd rect (at -3.55 4.445 180) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 23 "Net-(U3-Pad1)"))
    (pad 2 smd rect (at -3.55 3.175 180) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 24 "Net-(U3-Pad2)"))
    (pad 3 smd rect (at -3.55 1.905 180) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 25 "Net-(U3-Pad3)"))
    (pad 4 smd rect (at -3.55 0.635 180) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 33 RXD))
    (pad 5 smd rect (at -3.55 -0.635 180) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 7 "Net-(U1-Pad14)"))
    (pad 6 smd rect (at -3.55 -1.905 180) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(U1-Pad13)"))
    (pad 7 smd rect (at -3.55 -3.175 180) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(R6-Pad2)"))
    (pad 8 smd rect (at -3.55 -4.445 180) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 5 Earth))
    (pad 9 smd rect (at 3.55 -4.445 180) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 6 +5V))
    (pad 10 smd rect (at 3.55 -3.175 180) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 12 "Net-(J3-Pad4)"))
    (pad 11 smd rect (at 3.55 -1.905 180) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 11 "Net-(J3-Pad3)"))
    (pad 12 smd rect (at 3.55 -0.635 180) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 10 "Net-(J3-Pad2)"))
    (pad 13 smd rect (at 3.55 0.635 180) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 9 "Net-(J3-Pad1)"))
    (pad 14 smd rect (at 3.55 1.905 180) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 26 "Net-(U3-Pad14)"))
    (pad 15 smd rect (at 3.55 3.175 180) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 27 "Net-(U3-Pad15)"))
    (pad 16 smd rect (at 3.55 4.445 180) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 28 "Net-(U3-Pad16)"))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-16W_5.3x10.2mm_P1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-223-3_TabPin2 (layer F.Cu) (tedit 5A02FF57)
    (at 94.9325 69.5325 90)
    (descr "module CMS SOT223 4 pins")
    (tags "CMS SOT")
    (attr smd)
    (fp_text reference U2 (at -0.0635 0.0635 180) (layer F.SilkS))
    (fp_text value LM1117-3.3 (at 0 4.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 2 smd rect (at 3.15 0 90) (size 2 3.8) (layers F.Cu F.Paste F.Mask)
      (net 29 VCC))
    (pad 2 smd rect (at -3.15 0 90) (size 2 1.5) (layers F.Cu F.Paste F.Mask)
      (net 29 VCC))
    (pad 3 smd rect (at -3.15 2.3 90) (size 2 1.5) (layers F.Cu F.Paste F.Mask)
      (net 6 +5V))
    (pad 1 smd rect (at -3.15 -2.3 90) (size 2 1.5) (layers F.Cu F.Paste F.Mask)
      (net 5 Earth))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-223.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text JLCJLCJLCJLC (at 108.204 78.232 90) (layer B.SilkS))
  (gr_text "Curtain Driver v2\nbrnv.ru" (at 107.95 67.056) (layer F.SilkS))
  (gr_text "REED 2" (at 124.968 82.042 90) (layer F.SilkS))
  (gr_text "REED 1" (at 124.968 88.646 90) (layer F.SilkS))
  (gr_text DOWN (at 124.968 75.184 90) (layer F.SilkS))
  (gr_text UP (at 124.968 68.58 90) (layer F.SilkS))
  (gr_line (start 134 63.754) (end 134 93.5) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 78.9686 63.754) (end 78.9686 93.472) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 134 93.5) (end 78.9686 93.472) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 78.9686 63.754) (end 134 63.754) (layer Edge.Cuts) (width 0.15))
  (zone (net 5) (net_name Earth) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 78.994 93.472) (xy 133.985 93.472) (xy 133.985 63.754) (xy 78.994 63.754)
      )
    )
  )
  (zone (net 5) (net_name Earth) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 79.032075 63.6905) (xy 134.023075 63.6905) (xy 134.023075 93.4085) (xy 79.032075 93.4085)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (copperpour not_allowed))
    (fill (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 98.806 63.754) (xy 98.806 69.85) (xy 117.348 69.85) (xy 117.348 63.754)
      )
    )
  )
  (zone (net 0) (net_name "") (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (copperpour not_allowed))
    (fill (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 98.806 63.754) (xy 98.806 69.85) (xy 117.348 69.85) (xy 117.348 63.754)
      )
    )
  )
)
