Version 2.0 (ages ago): - Minimum distance for solder mask was increased in order to help soldering the components. - Also, the size of the pads were increased for the same purpose. - Some high voltage traces were changed to bottom layer due to the fact that some components does not accept soldering from top layer (this was before I choose plated holes option in assembling, now this change is obsolete) - The screw holes (for securing the board to the case) were increased to 2mm diameter. Version 3.0 (ages ago): - Changed the packaging of the transistors from SOT323 for SOT23, also, the pads who were incorrectly positioned were corrected. - There was the correction of the pads of the voltage regulator. - Changed the varistor from 20mm model to 10mm model. Version 4.0 (29/03/2018) - Changed the fuse, from a housing PTH soldered in the board to a housing placed in the case, thus, it will be necessary to solder wires from board to this housing. - After changing the fuse, all the dimensions of the board was decreased. Some componentes placement were made. - The screw holes (for securing the board to the case) were increased to 3mm diameter, following the Raspberry Pi standard.