(kicad_pcb (version 20170123) (host pcbnew no-vcs-found-f2763e9~58~ubuntu16.04.1)
  (general
    (links 103)
    (no_connects 0)
    (area 98.552 68.58 137.676302 105.936962)
    (thickness 1.6)
    (drawings 11)
    (tracks 455)
    (zones 0)
    (modules 42)
    (nets 22)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.25)
    (trace_clearance 0.25)
    (zone_clearance 0.4)
    (zone_45_only no)
    (trace_min 0.2)
    (segment_width 0.2)
    (edge_width 0.15)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 0.5 0.5)
    (mod_text_width 0.1)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.2)
    (aux_axis_origin 0 0)
    (visible_elements FFFFFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions true)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk true)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory gerber/))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 "Net-(C4-Pad2)")
  (net 3 /RST)
  (net 4 +3V3)
  (net 5 /MISO)
  (net 6 /SCK)
  (net 7 /MOSI)
  (net 8 /RFM69W_INT)
  (net 9 /RFM69W_SS)
  (net 10 "Net-(P1-Pad1)")
  (net 11 /ATSHA204A)
  (net 12 "Net-(D1-Pad2)")
  (net 13 /SPI_FLASH_SS)
  (net 14 "Net-(C2-Pad2)")
  (net 15 /V_BATT_MON)
  (net 16 "Net-(BT1-Pad1)")
  (net 17 /VB_IN)
  (net 18 "Net-(C12-Pad2)")
  (net 19 /SCL)
  (net 20 /SDA)
  (net 21 /A3212)
  (net_class Default "This is the default net class."
    (clearance 0.25)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +3V3)
    (add_net /A3212)
    (add_net /ATSHA204A)
    (add_net /MISO)
    (add_net /MOSI)
    (add_net /RFM69W_INT)
    (add_net /RFM69W_SS)
    (add_net /RST)
    (add_net /SCK)
    (add_net /SCL)
    (add_net /SDA)
    (add_net /SPI_FLASH_SS)
    (add_net /VB_IN)
    (add_net /V_BATT_MON)
    (add_net GND)
    (add_net "Net-(BT1-Pad1)")
    (add_net "Net-(C12-Pad2)")
    (add_net "Net-(C2-Pad2)")
    (add_net "Net-(C4-Pad2)")
    (add_net "Net-(D1-Pad2)")
    (add_net "Net-(P1-Pad1)")
  )
  (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 58D3ECB7)
    (at 130 75.9 135)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference R11 (at 1.697056 -0.141421 135) (layer B.SilkS))
    (fp_text value 51K (at 3.323402 -0.070711 135) (layer B.SilkS))
    (fp_text user %R (at 0 1.35 135) (layer B.Fab) hide)
    (pad 2 smd rect (at 0.45 0 135) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask)
      (net 21 /A3212))
    (pad 1 smd rect (at -0.45 0 135) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask)
      (net 4 +3V3))
    (model Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Symbols:OSHW-Logo_5.7x6mm_SilkScreen locked (layer B.Cu) (tedit 0)
    (at 128.4 95.6 225)
    (descr "Open Source Hardware Logo")
    (tags "Logo OSHW")
    (attr virtual)
    (fp_text reference REF*** (at 0 0 225) (layer B.SilkS) hide)
    (fp_text value OSHW-Logo_5.7x6mm_SilkScreen (at 0.75 0 225) (layer B.Fab) hide)
  )
  (module myfootprints:CR2032_BATT-HOLDER_SMT_H2 (layer B.Cu) (tedit 5889BC1D)
    (at 132.3848 86.868)
    (attr smd)
    (fp_text reference BT1 (at -15.7988 -10.414) (layer B.SilkS))
    (fp_text value CR2032-3V (at -15.7988 -9.398) (layer B.SilkS))
    (pad 1 smd rect (at -31.0388 0) (size 3.1496 4.7752) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(BT1-Pad1)"))
    (pad 2 smd rect (at 0 0 180) (size 3.1496 4.7752) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Battery_Holders.3dshapes/cr2032_holder_smd_H2.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module myfootprints:AVR_ISP_SMT_Small_02x03 (layer F.Cu) (tedit 58B03BB2)
    (at 116.84 100.838 180)
    (descr "SMT pin header")
    (tags "SMT pin header")
    (attr smd)
    (fp_text reference CON1 (at 6.54 0.238 270) (layer F.SilkS))
    (fp_text value AVR-ISP-6 (at 5.44 0.238 270) (layer F.SilkS))
    (pad 2 smd rect (at -2.54 -2 180) (size 1.27 2.5) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 4 smd rect (at 0 -2 180) (size 1.27 2.5) (layers F.Cu F.Paste F.Mask)
      (net 7 /MOSI))
    (pad 6 smd rect (at 2.54 -2 180) (size 1.27 2.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at 2.54 2 180) (size 1.27 2.5) (layers F.Cu F.Paste F.Mask)
      (net 3 /RST))
    (pad 3 smd rect (at 0 2 180) (size 1.27 2.5) (layers F.Cu F.Paste F.Mask)
      (net 6 /SCK))
    (pad 1 smd rect (at -2.5 2 180) (size 1.27 2.5) (layers F.Cu F.Paste F.Mask)
      (net 5 /MISO))
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 5885C052)
    (at 114.554 70.104)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C1 (at -2.354 0.096) (layer F.SilkS))
    (fp_text value 100n (at -2.754 0.896) (layer F.SilkS))
    (pad 1 smd rect (at -0.95 0) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 2 smd rect (at 0.95 0) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0603_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 5885C06F)
    (at 115.316 78.74)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C2 (at -1.016 -1.016 180) (layer F.SilkS))
    (fp_text value 100n (at 1.27 -1.016 180) (layer F.SilkS))
    (pad 2 smd rect (at 0.95 0) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(C2-Pad2)"))
    (pad 1 smd rect (at -0.95 0) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0603_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 5885C04E)
    (at 119.38 70.104 180)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C3 (at -2.42 -0.296 180) (layer F.SilkS))
    (fp_text value 100n (at -2.32 -1.196 180) (layer F.SilkS))
    (pad 1 smd rect (at -0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (model Capacitors_SMD.3dshapes/C_0603_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 5885C89A)
    (at 119.38 78.74 180)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C4 (at 1.016 1.016 180) (layer F.SilkS))
    (fp_text value 100n (at -1.016 1.016 180) (layer F.SilkS))
    (pad 1 smd rect (at -0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 2 "Net-(C4-Pad2)"))
    (model Capacitors_SMD.3dshapes/C_0603_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 5885C076)
    (at 103.378 77.978 90)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C5 (at -1.222 -1.978 90) (layer F.SilkS))
    (fp_text value 100n (at -0.222 -1.178 90) (layer F.SilkS))
    (pad 1 smd rect (at -0.95 0 90) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 0.95 0 90) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (model Capacitors_SMD.3dshapes/C_0603_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 5885C055)
    (at 119.314 80.264 180)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C7 (at 0.314 -1.736 180) (layer F.SilkS))
    (fp_text value 100n (at 0.314 -2.536 180) (layer F.SilkS))
    (pad 2 smd rect (at 0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (model Capacitors_SMD.3dshapes/C_0603_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 5885C04B)
    (at 132.588 82.042 90)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C8 (at -1.27 -1.016 90) (layer F.SilkS))
    (fp_text value 100n (at 1.524 -1.016 90) (layer F.SilkS))
    (pad 2 smd rect (at 0.95 0 90) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -0.95 0 90) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (model Capacitors_SMD.3dshapes/C_0603_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer B.Cu) (tedit 5885C072)
    (at 109.22 101.092 180)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C9 (at -1.524 -1.016 180) (layer B.SilkS))
    (fp_text value 10u (at 0.254 -1.016 180) (layer B.SilkS))
    (pad 2 smd rect (at 0.95 0 180) (size 1.2 0.75) (layers B.Cu B.Paste B.Mask)
      (net 17 /VB_IN))
    (pad 1 smd rect (at -0.95 0 180) (size 1.2 0.75) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0603_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 5885C069)
    (at 125.984 79.248 90)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C10 (at 0.048 1.616 180) (layer F.SilkS))
    (fp_text value 22u (at -0.952 1.616 180) (layer F.SilkS))
    (pad 1 smd rect (at -0.95 0 90) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 2 smd rect (at 0.95 0 90) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0603_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_Tantalum_SMD:CP_Tantalum_Case-C_EIA-6032-28_Hand (layer B.Cu) (tedit 5885C048)
    (at 116.84 71.628)
    (descr "Tantalum capacitor, Case C, EIA 6032-28, 6.0x3.2x2.5mm, Hand soldering footprint")
    (tags "capacitor tantalum smd")
    (attr smd)
    (fp_text reference C11 (at 7.56 -0.128) (layer B.SilkS))
    (fp_text value 220u (at 7.36 0.672 180) (layer B.SilkS))
    (pad 2 smd rect (at 3.125 0) (size 3.75 2.5) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -3.125 0) (size 3.75 2.5) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(BT1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitors_Tantalum_SMD.3dshapes/TantalC_SizeC_EIA-6032_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer B.Cu) (tedit 5885C05C)
    (at 116.332 102.108 90)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C12 (at -0.692 1.868 180) (layer B.SilkS))
    (fp_text value 68u (at -1.492 1.868 180) (layer B.SilkS))
    (pad 2 smd rect (at 0.95 0 90) (size 1.2 0.75) (layers B.Cu B.Paste B.Mask)
      (net 18 "Net-(C12-Pad2)"))
    (pad 1 smd rect (at -0.95 0 90) (size 1.2 0.75) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0603_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diodes_SMD:D_SOD-123 (layer B.Cu) (tedit 5885C080)
    (at 110.49 99.06 180)
    (descr SOD-123)
    (tags SOD-123)
    (attr smd)
    (fp_text reference D1 (at 0.69 2.26 180) (layer B.SilkS))
    (fp_text value 1N5819 (at 0.29 1.46 180) (layer B.SilkS))
    (pad 2 smd rect (at 1.65 0 180) (size 0.9 1.2) (layers B.Cu B.Paste B.Mask)
      (net 12 "Net-(D1-Pad2)"))
    (pad 1 smd rect (at -1.65 0 180) (size 0.9 1.2) (layers B.Cu B.Paste B.Mask)
      (net 18 "Net-(C12-Pad2)"))
    (model ${KISYS3DMOD}/SOD_Packages_SMD.3dshapes/SOD123.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Housings_DFN_QFN:QFN-32-1EP_5x5mm_Pitch0.5mm (layer F.Cu) (tedit 58D3F2CC)
    (at 117.094 74.2685 270)
    (descr "UH Package; 32-Lead Plastic QFN (5mm x 5mm); (see Linear Technology QFN_32_05-08-1693.pdf)")
    (tags "QFN 0.5")
    (attr smd)
    (fp_text reference IC1 (at 0.254 4.294 270) (layer F.SilkS))
    (fp_text value ATMEGA328P (at -0.6685 3.494 270) (layer F.SilkS))
    (pad 33 smd rect (at -0.8625 -0.8625 270) (size 1.725 1.725) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 33 smd rect (at -0.8625 0.8625 270) (size 1.725 1.725) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 33 smd rect (at 0.8625 -0.8625 270) (size 1.725 1.725) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 33 smd rect (at 0.8625 0.8625 270) (size 1.725 1.725) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 32 smd rect (at -1.75 -2.4) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 8 /RFM69W_INT))
    (pad 31 smd rect (at -1.25 -2.4) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 30 smd rect (at -0.75 -2.4) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 29 smd rect (at -0.25 -2.4) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 3 /RST))
    (pad 28 smd rect (at 0.25 -2.4) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 19 /SCL))
    (pad 27 smd rect (at 0.75 -2.4) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 20 /SDA))
    (pad 26 smd rect (at 1.25 -2.4) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 11 /ATSHA204A))
    (pad 25 smd rect (at 1.75 -2.4) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 24 smd rect (at 2.4 -1.75 270) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 15 /V_BATT_MON))
    (pad 23 smd rect (at 2.4 -1.25 270) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 22 smd rect (at 2.4 -0.75 270) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 21 smd rect (at 2.4 -0.25 270) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 20 smd rect (at 2.4 0.25 270) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 2 "Net-(C4-Pad2)"))
    (pad 19 smd rect (at 2.4 0.75 270) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 18 smd rect (at 2.4 1.25 270) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(C2-Pad2)"))
    (pad 17 smd rect (at 2.4 1.75 270) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 6 /SCK))
    (pad 16 smd rect (at 1.75 2.4) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 5 /MISO))
    (pad 15 smd rect (at 1.25 2.4) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 7 /MOSI))
    (pad 14 smd rect (at 0.75 2.4) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 9 /RFM69W_SS))
    (pad 13 smd rect (at 0.25 2.4) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 12 smd rect (at -0.25 2.4) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 13 /SPI_FLASH_SS))
    (pad 11 smd rect (at -0.75 2.4) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 10 smd rect (at -1.25 2.4) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 9 smd rect (at -1.75 2.4) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at -2.4 1.75 270) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at -2.4 1.25 270) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at -2.4 0.75 270) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 5 smd rect (at -2.4 0.25 270) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 4 smd rect (at -2.4 -0.25 270) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 3 smd rect (at -2.4 -0.75 270) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -2.4 -1.25 270) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 1 smd rect (at -2.4 -1.75 270) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 21 /A3212))
    (model ${KISYS3DMOD}/Housings_DFN_QFN.3dshapes/qfn32_5x5_p05.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module myfootprints:SDR0302 (layer B.Cu) (tedit 58823513)
    (at 105.664 96.266)
    (attr smd)
    (fp_text reference L1 (at 1.136 2.734 180) (layer B.SilkS))
    (fp_text value 47u (at -0.464 2.734 180) (layer B.SilkS))
    (pad 2 smd rect (at 1.2 0) (size 1.6 3.4) (layers B.Cu B.Paste B.Mask)
      (net 12 "Net-(D1-Pad2)"))
    (pad 1 smd rect (at -1.2 0) (size 1.6 3.4) (layers B.Cu B.Paste B.Mask)
      (net 17 /VB_IN))
    (model ${KISYS3DMOD}/Inductors.3dshapes/SDR0302.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module myfootprints:1pin_smd_2mm (layer F.Cu) (tedit 58807816)
    (at 103.732 83.92 90)
    (fp_text reference P1 (at 0 0.5 90) (layer F.SilkS) hide)
    (fp_text value ANTENNA (at -0.08 -1.732 90) (layer F.SilkS))
    (pad 1 smd rect (at -0.1 -0.1 90) (size 3 1.5) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(P1-Pad1)"))
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 5885C089)
    (at 108.12 73.406)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R1 (at -0.17 -1.206) (layer F.SilkS))
    (fp_text value 56K (at 1.608 -1.206) (layer F.SilkS))
    (pad 1 smd rect (at -1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 13 /SPI_FLASH_SS))
    (pad 2 smd rect (at 1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (model Resistors_SMD.3dshapes/R_0603_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 5885C062)
    (at 124.714 76.454)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R2 (at -1.114 -1.254) (layer F.SilkS))
    (fp_text value 1K (at 1.086 -1.254) (layer F.SilkS))
    (pad 1 smd rect (at -1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 11 /ATSHA204A))
    (pad 2 smd rect (at 1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (model Resistors_SMD.3dshapes/R_0603_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 5885C086)
    (at 124.714 72.898 180)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R3 (at 2.714 0.698 180) (layer F.SilkS))
    (fp_text value 10K (at 2.914 -0.102 180) (layer F.SilkS))
    (pad 2 smd rect (at 1.1 0 180) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 3 /RST))
    (pad 1 smd rect (at -1.1 0 180) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (model Resistors_SMD.3dshapes/R_0603_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 5885C058)
    (at 130.302 82.042 90)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R4 (at -1.358 -1.002 90) (layer F.SilkS))
    (fp_text value 10K (at 1.442 -1.102 90) (layer F.SilkS))
    (pad 2 smd rect (at 1.1 0 90) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 1 smd rect (at -1.1 0 90) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 19 /SCL))
    (model Resistors_SMD.3dshapes/R_0603_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 5885C05F)
    (at 131.064 90.678 180)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R5 (at 1.27 -1.27 180) (layer F.SilkS))
    (fp_text value 10K (at -0.762 -1.27 180) (layer F.SilkS))
    (pad 1 smd rect (at -1.1 0 180) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 20 /SDA))
    (pad 2 smd rect (at 1.1 0 180) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (model Resistors_SMD.3dshapes/R_0603_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 5885C07C)
    (at 103.548 92.71 90)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R6 (at -1.016 -1.186 90) (layer F.SilkS))
    (fp_text value 56K (at 1.524 -1.186 90) (layer F.SilkS))
    (pad 2 smd rect (at 1.1 0 90) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 1 smd rect (at -1.1 0 90) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 9 /RFM69W_SS))
    (model Resistors_SMD.3dshapes/R_0603_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 5885CB17)
    (at 107.95 76.962)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U1 (at -2.75 2.838 180) (layer F.SilkS))
    (fp_text value AT25DF512C (at -4.35 3.638 180) (layer F.SilkS))
    (pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 6 /SCK))
    (pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 7 /MOSI))
    (pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 5 /MISO))
    (pad 1 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 13 /SPI_FLASH_SS))
    (model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-23 (layer F.Cu) (tedit 5889BE59)
    (at 123.206 79.248)
    (descr "SOT-23, Standard")
    (tags SOT-23)
    (attr smd)
    (fp_text reference U2 (at -0.27 2.552 180) (layer F.SilkS))
    (fp_text value ATSHA204A (at -0.406 3.552) (layer F.SilkS))
    (pad 3 smd rect (at 1 0) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -1 0.95) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 1 smd rect (at -1 -0.95) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 11 /ATSHA204A))
    (model ${KISYS3DMOD}/SOT_Packages_SMD.3dshapes/SOT23-3.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_DFN_QFN:DFN-6-1EP_3x3mm_Pitch0.95mm (layer F.Cu) (tedit 5885C083)
    (at 132.334 86.868 90)
    (descr "DFN6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506AH.PDF)")
    (tags "DFN 0.95")
    (attr smd)
    (fp_text reference U3 (at -0.132 -2.934 90) (layer F.SilkS))
    (fp_text value Si7021 (at -0.132 -2.134 90) (layer F.SilkS))
    (pad 7 smd rect (at -0.425 -0.65 90) (size 0.85 1.3) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 7 smd rect (at -0.425 0.65 90) (size 0.85 1.3) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 7 smd rect (at 0.425 -0.65 90) (size 0.85 1.3) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 7 smd rect (at 0.425 0.65 90) (size 0.85 1.3) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 6 smd rect (at 1.34 -0.95 90) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 19 /SCL))
    (pad 5 smd rect (at 1.34 0 90) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 4 smd rect (at 1.34 0.95 90) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at -1.34 0.95 90) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -1.34 0 90) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.34 -0.95 90) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask)
      (net 20 /SDA))
    (model ${KISYS3DMOD}/Sensors.3dshapes/SHT21.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module mysensors_radios:RFM69HW_SMD_Handsoldering (layer F.Cu) (tedit 5885C0BE)
    (at 125.346 96.106 180)
    (descr RFM69HW)
    (tags "RFM69HW, RF69")
    (fp_text reference U4 (at 8.506 8.444 180) (layer F.SilkS))
    (fp_text value RFM69W (at 8.382 7.112 180) (layer F.SilkS))
    (pad 16 smd rect (at 18.3 0 180) (size 3 1.2) (layers F.Cu F.Paste F.Mask))
    (pad 15 smd rect (at 18.3 2 180) (size 3 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 /RFM69W_SS))
    (pad 14 smd rect (at 18.3 4 180) (size 3 1.2) (layers F.Cu F.Paste F.Mask)
      (net 7 /MOSI))
    (pad 13 smd rect (at 18.3 6 180) (size 3 1.2) (layers F.Cu F.Paste F.Mask)
      (net 5 /MISO))
    (pad 12 smd rect (at 18.3 8 180) (size 3 1.2) (layers F.Cu F.Paste F.Mask)
      (net 6 /SCK))
    (pad 11 smd rect (at 18.3 10 180) (size 3 1.2) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 10 smd rect (at 18.3 12 180) (size 3 1.2) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(P1-Pad1)"))
    (pad 9 smd rect (at 18.3 14 180) (size 3 1.2) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 8 smd rect (at -1.4 14 180) (size 3 1.2) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 7 smd rect (at -1.4 12 180) (size 3 1.2) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at -1.4 10 180) (size 3 1.2) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at -1.4 8 180) (size 3 1.2) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at -1.4 6 180) (size 3 1.2) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at -1.4 4 180) (size 3 1.2) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -1.4 2 180) (size 3 1.2) (layers F.Cu F.Paste F.Mask)
      (net 8 /RFM69W_INT))
    (pad 1 smd rect (at -1.4 0 180) (size 3 1.2) (layers F.Cu F.Paste F.Mask))
    (model ${KISYS3DMOD}/Radio_Modules.3dshapes/RFM69W.stp
      (at (xyz 0.6692913385826772 -0.5511811023622047 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-23-5 (layer B.Cu) (tedit 5885C066)
    (at 113.284 102.108 180)
    (descr "5-pin SOT23 package")
    (tags SOT-23-5)
    (attr smd)
    (fp_text reference U5 (at -1.916 3.108 180) (layer B.SilkS))
    (fp_text value NCP1402 (at -1.516 2.108 180) (layer B.SilkS))
    (pad 5 smd rect (at 1.1 0.95 180) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 12 "Net-(D1-Pad2)"))
    (pad 4 smd rect (at 1.1 -0.95 180) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 3 smd rect (at -1.1 -0.95 180) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask))
    (pad 2 smd rect (at -1.1 0 180) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 18 "Net-(C12-Pad2)"))
    (pad 1 smd rect (at -1.1 0.95 180) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 18 "Net-(C12-Pad2)"))
    (model ${KISYS3DMOD}/SOT_Packages_SMD.3dshapes/SOT23-5.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 5885C74A)
    (at 115.316 80.264 180)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference L2 (at 0.316 -1.778 180) (layer F.SilkS))
    (fp_text value BLM18HE152 (at 0.716 -2.536 180) (layer F.SilkS))
    (pad 1 smd rect (at -1.1 0 180) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(C2-Pad2)"))
    (pad 2 smd rect (at 1.1 0 180) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (model Resistors_SMD.3dshapes/R_0603_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 5885C753)
    (at 113.284 74.422 180)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R7 (at 2.794 0.254 180) (layer B.SilkS))
    (fp_text value 1M (at 2.794 -0.508 180) (layer B.SilkS))
    (pad 2 smd rect (at 1.1 0 180) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(BT1-Pad1)"))
    (pad 1 smd rect (at -1.1 0 180) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
      (net 15 /V_BATT_MON))
    (model Resistors_SMD.3dshapes/R_0603_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 5885C750)
    (at 117.518 74.422 180)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R8 (at -3.048 0.508 180) (layer B.SilkS))
    (fp_text value 470K (at -3.082 -0.508 180) (layer B.SilkS))
    (pad 2 smd rect (at 1.1 0 180) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
      (net 15 /V_BATT_MON))
    (pad 1 smd rect (at -1.1 0 180) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0603_HandSoldering.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5889B2EB)
    (at 101.8 93.4 180)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference JP1 (at -1.8 2.6 180) (layer B.SilkS))
    (fp_text value VB_EN (at -2.35 -0.2 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask)
      (net 17 /VB_IN))
    (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(BT1-Pad1)"))
  )
  (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5889B2EF)
    (at 101.8 91.6)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference JP2 (at 1.8 1.2) (layer B.SilkS))
    (fp_text value VB_DIS (at 2.6 0) (layer B.SilkS))
    (pad 2 smd rect (at 0.45 0) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask)
      (net 4 +3V3))
    (pad 1 smd rect (at -0.45 0) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(BT1-Pad1)"))
  )
  (module Resistors_SMD:R_0402 (layer B.Cu) (tedit 5889B2F2)
    (at 118.6 101.2)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference JP3 (at 0.4 -2) (layer B.SilkS))
    (fp_text value VB_EN (at 0.2 -1.2 180) (layer B.SilkS))
    (pad 2 smd rect (at 0.45 0) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask)
      (net 4 +3V3))
    (pad 1 smd rect (at -0.45 0) (size 0.4 0.6) (layers B.Cu B.Paste B.Mask)
      (net 18 "Net-(C12-Pad2)"))
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 58B0396F)
    (at 121.6 99.5 270)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C13 (at 3.9 0.3 270) (layer F.SilkS))
    (fp_text value 100n (at 3.4 -0.6 270) (layer F.SilkS))
    (fp_text user %R (at 4.6 -4 270) (layer F.Fab) hide)
    (pad 2 smd rect (at 0.95 0 270) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -0.95 0 270) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 58B03744)
    (at 124.3 101.4 180)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R9 (at 1.3 -1.1) (layer F.SilkS))
    (fp_text value 10K (at 0 -1.1) (layer F.SilkS))
    (fp_text user %R (at 0 -1.45 180) (layer F.Fab) hide)
    (pad 1 smd rect (at -1.1 0 180) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 19 /SCL))
    (pad 2 smd rect (at 1.1 0 180) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (model Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 58B0327B)
    (at 128 98.2)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R10 (at 1.4 -1.9 90) (layer F.SilkS))
    (fp_text value 10K (at 2.2 -3 90) (layer F.SilkS))
    (fp_text user %R (at 2.7 -2.6) (layer F.Fab) hide)
    (pad 2 smd rect (at 1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (pad 1 smd rect (at -1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 20 /SDA))
    (model Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_DFN_QFN:DFN-6-1EP_2x2mm_Pitch0.65mm (layer F.Cu) (tedit 58B0398D)
    (at 124.2 99.4)
    (descr "6-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "DFN 0.65")
    (attr smd)
    (fp_text reference U6 (at 2.2 0.3 90) (layer F.SilkS))
    (fp_text value MAX44009 (at -0.1 -1.6) (layer F.SilkS))
    (pad 7 smd rect (at 0 -0.4) (size 1 0.8) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 7 smd rect (at 0 0.4) (size 1 0.8) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 6 smd rect (at 1.05 -0.65) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask)
      (net 20 /SDA))
    (pad 5 smd rect (at 1.05 0) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask)
      (net 19 /SCL))
    (pad 4 smd rect (at 1.05 0.65) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at -1.05 0.65) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -1.05 0) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.05 -0.65) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Housings_DFN_QFN.3dshapes/dfn6_2x2_p065.stp
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 58D3ECC8)
    (at 128.7 79.5 315)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C6 (at 0.848528 0.848528 315) (layer B.SilkS))
    (fp_text value 100n (at -1.272792 0.848528 315) (layer B.SilkS))
    (fp_text user %R (at 0 1.270001 315) (layer B.Fab) hide)
    (pad 2 smd rect (at 0.55 0 315) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask)
      (net 4 +3V3))
    (pad 1 smd rect (at -0.55 0 315) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x03_Pitch1.27mm (layer F.Cu) (tedit 58D3EC18)
    (at 130.1 78.1 225)
    (descr "Through hole straight pin header, 1x03, 1.27mm pitch, single row")
    (tags "Through hole pin header THT 1x03 1.27mm single row")
    (fp_text reference J1 (at -0.141421 4.101219 225) (layer F.SilkS))
    (fp_text value A3212 (at -1.767767 1.909188 315) (layer F.SilkS))
    (fp_text user %R (at 0 -1.695 225) (layer F.Fab) hide)
    (pad 3 thru_hole oval (at 0 2.54 225) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 21 /A3212))
    (pad 2 thru_hole oval (at 0 1.27 225) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole rect (at 0 0 225) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 4 +3V3))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_1x03_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text OUT (at 127.4 75.5 45) (layer B.SilkS))
  (gr_text GND (at 128.3 78 315) (layer B.SilkS))
  (gr_text +3V3 (at 131.1 79 45) (layer B.SilkS))
  (gr_text "Rev. 0.4" (at 105.1 77.8 45) (layer B.SilkS))
  (gr_text SCK (at 115.6 98.6 90) (layer F.SilkS))
  (gr_text MISO (at 118.2 98.6 90) (layer F.SilkS))
  (gr_text +3V3 (at 118.2 103.2 90) (layer F.SilkS))
  (gr_text MOSI (at 115.6 103.2 90) (layer F.SilkS))
  (gr_text GND (at 112.4 102.8 90) (layer F.SilkS))
  (gr_text RST (at 112.4 98.6 90) (layer F.SilkS))
  (gr_circle (center 116.84 86.868) (end 131.826 96.774) (layer Edge.Cuts) (width 0.15))
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.4) (thermal_bridge_width 0.4))
    (polygon
      (pts
        (xy 98.552 68.58) (xy 135.128 68.58) (xy 135.128 105.156) (xy 98.552 105.156)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.4) (thermal_bridge_width 0.4))
    (polygon
      (pts
        (xy 98.552 68.58) (xy 135.128 68.58) (xy 135.128 105.156) (xy 98.552 105.156)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4))
    (min_thickness 0.254)
    (keepout (tracks allowed) (vias allowed) (copperpour not_allowed))
    (fill yes (arc_segments 32) (thermal_gap 0.4) (thermal_bridge_width 0.4))
    (polygon
      (pts
        (xy 117.6 77.2) (xy 120 77.2) (xy 120 78.2) (xy 117.6 78.2)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4))
    (min_thickness 0.254)
    (keepout (tracks allowed) (vias allowed) (copperpour not_allowed))
    (fill yes (arc_segments 32) (thermal_gap 0.4) (thermal_bridge_width 0.4))
    (polygon
      (pts
        (xy 113.8 97.2) (xy 120.8 97.2) (xy 120.8 104.2) (xy 113.8 104.2)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4))
    (min_thickness 0.254)
    (keepout (tracks allowed) (vias allowed) (copperpour not_allowed))
    (fill yes (arc_segments 32) (thermal_gap 0.4) (thermal_bridge_width 0.4))
    (polygon
      (pts
        (xy 129.2 81.8) (xy 134 81.8) (xy 134.6 85.6) (xy 134.2 90.4) (xy 133.2 93.4)
        (xy 131.6 96.6) (xy 128.2 100.4) (xy 125.8 102.2) (xy 125.2 101.6)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4))
    (min_thickness 0.254)
    (keepout (tracks allowed) (vias allowed) (copperpour not_allowed))
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 104.2 89.4) (xy 105.4 89.4) (xy 105.4 93.8) (xy 104.2 93.8)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4))
    (min_thickness 0.254)
    (keepout (tracks allowed) (vias allowed) (copperpour not_allowed))
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 102.4 81.8) (xy 105.2 81.8) (xy 105.2 86.2) (xy 102.4 86.2) (xy 101.8 86.2)
        (xy 101 85.6) (xy 101 82.4)
      )
    )
  )
)
